Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Florian Debret
> 3 dayAcheté sur Amazon car moins cher pour lanniversaire dun ami, celui-ci ma dit en être satisfait car de meilleur qualité que la plus part des produits actuellement sur le marché !
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Fernando
> 3 dayExcelente, alcanza para 10 laptops aproximadamente.
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ghislain deschenes
> 3 daysemble dans les normes ,résultat a voir dans les mois à venir.
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Sandeep.k
> 3 dayExcellent performance and thermal cooling.
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C.P
> 3 dayDie Wärmeleitpaste von Noctua ist zwar nicht ganz billig aber sie ist jeden Cent wert. Zusammen mit meinem Arctic liquid Freezer 120 bleibt mein Intel i5 8400 auch unter Last deutlich unter 50 Grad.
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LOIC ADAM
> 3 dayPâte utilisée lors de lupgrade de 4 processeurs XEON dans 2 workstations. Très facile dutilisation et qui donne entière satisfaction.
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Sam
> 3 dayTrès bon produit
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Melvin Kihn
> 3 dayFacile a étaler, rapport qualité prix intéressant,
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George
> 3 dayI used this thermal paste a couple months ago and my temps have never been better. I was able to get it down by almost eight degrees Celsius. Super easy to use and surprisingly I was able to close it and apply it without making a single mess.
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Saurabh Nakkarike
> 3 dayI bought these after reading about them on online tech forums and i was amazed by its performance.My temps dropped from 85 degree to 75 degree.One of the best thermal paste...no comments.
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
