Noctua NT-H2 3.5g, Thermal Computer Paste incl. 3 Cleaning Wipes (3.5g)
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Mr O J Bayntun
> 3 dayFantastic product as always from Noctua, absolutely terrible service from the Amazon courier as usual. I live in a flat and the package was just left out on a random step in the main stairwell, not even on my floor or outside my door, not good Amazon, sort it out as packages go missing here a lot.
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astror
> 3 dayMuy buena pasta como no podía ser de otra forma
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A
> 3 dayIch bin sehr zufrieden mit der Wärmeleitpaste.
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Alexander
> 3 dayMuy buena pasta términa, fácil de usar. A esperar con los años a ver cómo se comporta. Hasta ahora, súper conforme.
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Sebastian K.
Greater than one weekDurch die Paste konnte ich bei meiner 1070ti etwa 3-5°C sparen (inkl. Overclock auf 1080 Niveau). Lässt sich gut verteilen und dosieren. Einzig die Reinigungspads haben mich enttäuscht, diese hinterlassen Rückstände auf den Flächen, sodass ich nochmal nachwischen musste.
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FarinatoTV
> 3 dayLa mejor pasta que e probado en mi vida, reduce muchisimo la temperatura comparada con otras.
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Edward
> 3 dayUna de las mejores pastas térmicas del mercado la recomiendo 100%
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Mohamad M.
> 3 dayI have a Dell XPS 9570.
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Sergio
> 3 dayHas a great instruction paper and it performs awesome just a little hard to get it to cover the whole thing, had to go in twice.
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Luca Romano
> 3 dayOttimo prodotto, sono davvero contento della mia scelta. una garanzia
NT-H2 is the further improved second generation of Noctua’s award-winning hybrid thermal compound. Combining the iconic NT-H1’s proven features, superb ease-of-use and renowned long-term stability with a novel, fine-tuned formula of micro particles for even better thermal performance, NT-H2 is an enthusiast-grade paste for the highest demands. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results and thanks to the included cleaning wipes, it is just as easy to remove as to apply.
Next-generation performance
Further improving the award-winning NT-H1, NT-H2 uses a new, fine-tuned mixture of metal oxide micro-particles for even lower thermal resistance and reduced bond-line thickness at typical mounting pressures. This allows it to achieve even better performance in most application scenarios.
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Easy to clean with included wipesThe 3.5g pack of NT-H2 includes three large NA-CW1 cleaning wipes that are pre-moistened with an isopropyl alcohol mixture and make it child’s play to remove: Simply wipe off the paste from the CPU and the base of the cooler using one of the wipes and you’re done! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H2 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H2 unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H2 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description: | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size: | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume: | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density: | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes: | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
